The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

Jul. 10, 2001
Applicant:
Inventors:

Takeshi Arai, Annaka, JP;

Tadaaki Honma, Annaka, JP;

Hitoshi Habuka, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 2/510 ;
U.S. Cl.
CPC ...
C30B 2/510 ;
Abstract

A surface roughness distribution in the surface of a silicon epitaxial wafer is made uniform by optimizing a temperature distribution in the surface of a susceptor used in a vapor phase thin film growth apparatus. The susceptor is not supported by its center of the rear surface thereof, but only the peripheral portion thereof is supported using vertical pins respectively provided at the far ends of spokes radially branched from a rotary shaft. The susceptor is constituted so that a difference in temperature between the maximum and minimum in the surface of a silicon wafer is suppressed to a value equal to or less than 7° C. Hence, a surface roughness distribution in the surface of the silicon epitaxial wafer can be suppressed to a value equal to or less than 0.02 ppm.

Published as:

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