The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Sep. 02, 1998
Applicant:
Inventors:
Fumio Kuriyama, Yokohama, JP;
Akihisa Hongo, Yokohoma, JP;
Hiroaki Inoue, Machida, JP;
Tsuyoshi Tokuoka, Fujisawa, JP;
Assignee:
Ebara Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ;
U.S. Cl.
CPC ...
B05D 5/12 ;
Abstract
A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method involves immersing the substrate in a liquid held in a processing chamber, evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities, and subjecting the liquid to boiling in at least those regions adjacent to the substrate.
Kuriyama, Fumio. (2003). Method and apparatus for plating a substrate (U.S. Patent No. 6544585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6544585
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile