The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2002
Filed:
Jan. 03, 2001
Abstract
A chip scale package comprises a film substrate attached to the active surface of a semiconductor chip by an adhesive layer. The adhesive layer has a plurality of apertures formed corresponding to bonding pads on the chip. The film substrate includes a film and a plurality of conductive leads formed thereon. The film has a plurality of first openings formed corresponding to the apertures of the adhesive layer and a plurality of second openings. Each lead on the film has a first end portion projecting into one of the first openings of the film and a second end portion exposed from one of the second openings of the film. Each aperture and corresponding first opening are filled with a conductive paste embedding the first end portion of one lead therein so as to electrically connect the bonding pads of the chip and the conductive leads of the film substrate. A plurality of solder bumps formed on the second end portions of leads through the second openings of the film. This invention further provides a method of making the chip scale package.