Xin Hui Lee

Title: Innovations by Xin Hui Lee in Semiconductor Technology

Introduction

Xin Hui Lee is an accomplished inventor based in Kaohsiung, Taiwan, known for his contributions to semiconductor packaging technologies. With a record of two patents, Lee has made significant strides in enhancing the performance and reliability of chip scale packages.

Latest Patents

One of Lee's prominent inventions is a patented chip scale package and its manufacturing method. This innovative chip scale package consists of a substrate attached to the active surface of a semiconductor chip using an anisotropic conductive adhesive film (ACF). The design features several contact pads on the lower surface of the substrate, which are electrically connected to solder pads on the upper surface, allowing for efficient electrical transmission. Metal bumps placed on the contact pads establish connections with corresponding bonding pads on the chip, facilitating optimal functionality.

Additionally, the method for manufacturing the chip scale package is conducted at the wafer level. This process involves attaching substrates to chips one by one, effectively mitigating issues related to coefficient of thermal expansion (CTE) mismatch. By doing so, Lee has significantly improved product yields, making his invention crucial in the semiconductor industry.

Another noteworthy patent by Lee provides a distinct chip scale package that employs a film substrate attached to the semiconductor chip’s active surface via an adhesive layer. This design incorporates apertures that align with the bonding pads on the chip, along with conductive leads formed on the film substrate. The innovation ensures robust electrical connections and enhances the overall performance of the semiconductor devices.

Career Highlights

Lee's impressive body of work is recognized in the semiconductor engineering field, particularly through his role at Advanced Semiconductor Engineering, Inc. His expertise in innovation and engineering has played a pivotal role in advancing packaging technologies that meet modern demands.

Collaborations

Throughout his career, Lee has collaborated with notable colleagues, including Yi-Chuan Ding and Kun-Ching Chen. These collaborations have further enriched his work, leading to innovative solutions in semiconductor packaging.

Conclusion

Xin Hui Lee's contributions to the field of semiconductor technology through his patents and collaborations exemplify his role as an influential inventor. His work not only enhances the performance of semiconductor devices but also paves the way for future innovations in the industry.