The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Aug. 30, 1999
Syun-Ming Jang, Hsinchu, TW;
Mong-Song Liang, Taipei, TW;
Chen-Hua Yu, Keelung, TW;
Chung-Shi Liu, Hsinchu, TW;
Jane-Bai Lai, Fengyuan, TW;
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Abstract
Cu, for its rather loe resistivity, will be widely used in sub-quarter micron meter ULSI devices. However, it is well known that Cu is easy to be corroded as exposed in air. In packaging of chips the bonding pads making of Cu will thus oxides. In addition, the reaction between Au-ball and Cu pads is very poor. On the other hand, a native AlOx layer, about 3-4 nm in thickness, will form as Al exposes in air; the formed layer is inert and is capable of protecting Al from corrosion. Furthermore, the reaction between Au-ball and Al was very well. Therefore, with the methods of the present invention, Al or AlCu as a glue and protection layer is implemented on Cu bonding pads for successful Au wiring.