The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Feb. 19, 1999
Applicant:
Inventors:
Mike L. Bowman, Chandler, AZ (US);
Gene Hempel, Gilbert, AZ (US);
Chris Karlsrud, Chandler, AZ (US);
Franklin D. Root, Phoenix, AZ (US);
Assignee:
Speedfam-IPEC Corporation, Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ; B24B 5/00 ; B24B 7/19 ;
U.S. Cl.
CPC ...
B24B 1/00 ; B24B 5/00 ; B24B 7/19 ;
Abstract
Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.