Company Filing History:
Years Active: 2001-2003
Title: Innovations by Mike L. Bowman in Semiconductor Processing
Introduction
Mike L. Bowman is a prominent inventor based in Chandler, AZ, known for his noteworthy contributions to the field of semiconductor processing. With a total of five patents to his name, Bowman's work focuses on advancements that enhance the efficiency and effectiveness of wafer polishing systems.
Latest Patents
Among his latest innovations is the "Dual Purpose Handoff Station for Workpiece Polishing Machine." This invention provides a dual-purpose workpiece handoff station designed for staging semiconductor wafers between processing stations, such as those found in Chemical-Mechanical Planarization (CMP) machines. The handoff station features a processing surface, such as a polishing or buffing pad, designed with multiple apertures to apply fluids like water, chemicals, or vacuum. This innovative design allows for polishing, buffing, or cleaning of the wafer while it is transferred from one processing surface to another, significantly improving the overall workflow. Another notable patent is centered around "Arrangements for Wafer Polishing," which involves a series of polish modules and secondary modules interconnected by a conveyor to streamline the wafer transfer process after polishing operations are completed.
Career Highlights
Mike L. Bowman currently works at Speedfam-IPEC Corporation, where he has been instrumental in developing innovative solutions for semiconductor manufacturing. Through his directed efforts, he continuously contributes to advancing the technology used in wafer processing, enhancing the performance of industrial applications.
Collaborations
Throughout his career, Bowman has collaborated with notable coworkers such as Gene Hempel and Chris E. Karlsrud. These partnerships have further fueled innovation within Speedfam-IPEC Corporation, as they combine their expertise to tackle complex engineering challenges in semiconductor processing.
Conclusion
Mike L. Bowman stands out as a leader in the field of semiconductor innovations, holding multiple patents that reflect his commitment to advancing technology. His latest inventions promise to set new standards in wafer polishing, highlighting his valuable contributions to the industry and exemplifying the spirit of innovation in semiconductor manufacturing.