The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2001

Filed:

Oct. 01, 1998
Applicant:
Inventors:

Coming Chen, Taoyuan Hsien, TW;

Juan-Yuan Wu, Hsinchu, TW;

Jenn Tsao, Taipei, TW;

Water Lur, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 ;
U.S. Cl.
CPC ...
G03F 7/00 ;
Abstract

A method of trench polishing. A semiconductor substrate is provided. A photo-mask with a pattern is provided. The method of fabricating the photo-mask further comprising providing an original pattern which comprises a plurality of active regions with individual size. The original pattern is enlarged outwards to connect and merge some of the active regions. The active regions is diminished inwards until some small active regions eliminate, the diminished line width being denoted as B. A reverse treatment is performed to obtain a reverse pattern. The reverse pattern is enlarged with a line width C. The reverse pattern is combined with the original pattern. The substrate is patterned with the photo-mask with the combined pattern. An insulation layer is formed on the substrate. The insulation layer is polished.


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