The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Oct. 22, 1999
Applicant:
Inventors:
Juen-Kuen Lin, Kaohsiung City, TW;
Chien-Hsin Lai, Kaohsiung, TW;
Peng-Yih Peng, Hsinchu, TW;
Kun-Lin Wu, Taichung City, TW;
Daniel Chiu, Hsinchu Hsien, TW;
Chih-Chiang Yang, Hsinchu, TW;
Juan-Yuan Wu, Hsinchu, TW;
Hao-Kuang Chiu, Hsinchu, TW;
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.