The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Apr. 30, 1998
Peter J Brofman, Hopewell Junction, NY (US);
Mark G Courtney, Poughkeepsie, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
Mario J Interrante, New Paltz, NY (US);
Raymond A Jackson, Poughkeepsie, NY (US);
Gregory B Martin, Wappingers Falls, NY (US);
Sudipta K Ray, Wappingers Falls, NY (US);
William E Sablinski, Beacon, NY (US);
Kathleen A Stalter, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.