The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2000

Filed:

Apr. 21, 1999
Applicant:
Inventors:

Jacek Lagowski, Tampa, FL (US);

Alexander Savtchouk, Tampa, FL (US);

Nick Kochev, St. Petersburg, FL (US);

Charles Schraver, Palm Harbor, FL (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324755 ; 324765 ;
Abstract

The invention relates to a device for contacting and electrically grounding semiconductor substrate coated with or otherwise having an insulating film positioned thereover. The device includes a chuck having a wafer support surface which holds the wafer and a scriber movably attached to the chuck. The scriber is configured to contact the wafer through an opening in the chuck and to produce a perforation through the insulating film. The device further includes an electrically conductive probe movably attached to the chuck and configured to be moved into an access opening in the chuck to contact the semiconductor substrate through the perforation. Thus, the device increases the accuracy of open circuit type measurements of the wafer surface potential, particularly for Kelvin and Monroe electrode measurements of electrical properties of insulating films on semiconductor substrates.


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