The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2000

Filed:

May. 22, 1997
Applicant:
Inventors:

Joseph Fjelstad, Sunnyvale, CA (US);

Thomas H DiStefano, Monte Sereno, CA (US);

Konstantine Karavakis, Pleasanton, CA (US);

Anthony B Faraci, Georgetown, TX (US);

Tan Nguyen, Santa Clara, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 70 ; 29843 ; 324754 ; 324755 ; 324757 ; 324765 ; 2281801 ; 361774 ;
Abstract

A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.


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