The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 1999
Filed:
Sep. 14, 1998
Steven Paul Gasparovic, Santa Clara, CA (US);
Lee Hock Eng, Singapore, SG;
Ng Lea Swee, Singapore, SG;
Philip Earle Clark, Beaverton, OR (US);
Ronald K Anderson, Beaverton, OR (US);
Alan Scott Gibbons, Newberg, OR (US);
DiCon (S) PTE Ltd., Singapore, SG;
DiCON Connectors, Inc., San Jose, CA (US);
Focus Enhancements, Inc., Sudbury, MA (US);
Abstract
A cable-to-board arrangement configured to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. The cable-to-board arrangement includes a first nonconductive housing and a flexible board having thereon a plurality of conductive traces. The conductive traces have first ends and second ends opposite the first ends with the first ends being electrically coupled to the wires. The first nonconductive housing encapsulates a first portion of the flexible board including the first ends. The cable-to-board arrangement further includes a plurality of conductive legs configured for coupling with the surface-mounted pads on the board. The plurality of conductive legs are electrically coupled to the second ends of the conductive traces. There is also included a second nonconductive housing encapsulating a second portion of the flexible board including the second ends of the conductive traces and a portion of the conductive legs. Further, there is included an RF partition disposed proximate said flexible board for reducing RF emission from the circuit board in the direction toward the first non-conductive housing.