Santa Clara, CA, United States of America

Steven Paul Gasparovic

This inventor holds 2 USPTO granted patents. Top assignees: Dicon (S) Pte Ltd., Dicon Connectors, Inc., Focus Enhancements, Inc.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Steven Paul Gasparovic. Retrieved from https://idiyas.com/inventor/steven-paul-gasparovic

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1999

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2 patents (USPTO):Explore Patents

Title: Innovations by Steven Paul Gasparovic

Introduction

Steven Paul Gasparovic is an accomplished inventor based in Santa Clara, CA. He holds 2 patents that showcase his expertise in cable-to-board arrangements and assemblies, contributing significantly to the field of electronics.

Latest Patents

His latest patents include "Cable-to-board arrangements for enhanced RF shielding" and "Cable-to-board assemblies." The first patent describes a cable-to-board arrangement designed to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. This innovative design features a first nonconductive housing and a flexible board with conductive traces that enhance RF shielding. The second patent outlines a similar cable-to-board assembly, emphasizing the importance of secure connections and effective RF emission reduction.

Career Highlights

Throughout his career, Steven has worked with notable companies such as Dicon Pte Ltd. and Dicon Connectors, Inc. His contributions to these organizations have helped advance technology in the electronics sector.

Collaborations

Steven has collaborated with professionals like Lee Hock Eng and Ng Lea Swee, further enriching his experience and expertise in the field.

Conclusion

Steven Paul Gasparovic's innovative work in cable-to-board technology demonstrates his commitment to enhancing electronic connectivity and RF shielding. His patents reflect a significant contribution to the industry, showcasing his skills as an inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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