Company Filing History:
2 out of 2 
2 out of 2 
1 out of 8 Years Active: 1999
Title: Innovations by Ng Lea Swee
Introduction
Ng Lea Swee is a notable inventor based in Singapore, recognized for his contributions to the field of cable-to-board arrangements. He holds 2 patents that showcase his innovative approach to enhancing RF shielding in electronic devices.
Latest Patents
Ng Lea Swee's latest patents include "Cable-to-board arrangements for enhanced RF shielding" and "Cable-to-board assemblies." The first patent describes a cable-to-board arrangement designed to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. This arrangement features a first nonconductive housing and a flexible board with multiple conductive traces. The conductive traces connect the wires to the circuit board, while an RF partition is included to reduce RF emissions. The second patent outlines a similar cable-to-board assembly, emphasizing the nondetachable coupling of wires and the encapsulation of conductive traces within nonconductive housings.
Career Highlights
Throughout his career, Ng Lea Swee has worked with various companies, including Dicon (S) Pte Ltd. and Dicon Connectors, Inc. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic connectivity.
Collaborations
Ng Lea Swee has collaborated with professionals such as Steven Paul Gasparovic and Lee Hock Eng, further enhancing his work in the field of electronic innovations.
Conclusion
Ng Lea Swee's contributions to cable-to-board technology reflect his commitment to innovation and excellence in the electronics industry. His patents demonstrate a significant advancement in RF shielding and connectivity solutions.