Company Filing History:
1 out of 2 
1 out of 2 
1 out of 8 Years Active: 1999
Title: Philip Earle Clark: Innovator in Cable-to-Board Arrangements
Introduction
Philip Earle Clark is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of electrical engineering, particularly in the area of cable-to-board arrangements. His innovative designs focus on enhancing RF shielding, which is crucial for modern electronic devices.
Latest Patents
Clark holds a patent for a cable-to-board arrangement designed to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. This arrangement includes a first nonconductive housing and a flexible board with conductive traces. The design aims to reduce RF emissions from the circuit board, thereby improving the overall performance of electronic devices.
Career Highlights
Throughout his career, Philip Earle Clark has worked with various companies, including Dicon Pte Ltd. and Dicon Connectors, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the electronics industry.
Collaborations
Clark has collaborated with several professionals in his field, including Steven Paul Gasparovic and Lee Hock Eng. These partnerships have fostered a creative environment that has led to advancements in technology and engineering.
Conclusion
Philip Earle Clark's contributions to cable-to-board arrangements and RF shielding demonstrate his commitment to innovation in the electronics sector. His work continues to influence the design and functionality of modern electronic devices.