Company Filing History:
2 out of 2 
2 out of 2 
1 out of 8 Years Active: 1999
Title: Innovations by Lee Hock Eng
Introduction
Lee Hock Eng is a notable inventor based in Singapore, recognized for his contributions to the field of cable-to-board arrangements. With a total of 2 patents, he has made significant advancements in enhancing RF shielding and improving cable-to-board assemblies.
Latest Patents
Lee Hock Eng's latest patents include innovative designs for cable-to-board arrangements that enhance RF shielding. The first patent describes a cable-to-board arrangement configured to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. This arrangement features a first nonconductive housing and a flexible board with a plurality of conductive traces. The conductive traces have first ends that are electrically coupled to the wires, while the second ends connect to conductive legs that couple with the surface-mounted pads on the board. Additionally, an RF partition is included to reduce RF emissions from the circuit board. The second patent focuses on a similar cable-to-board assembly, emphasizing the same structural components and functionalities.
Career Highlights
Throughout his career, Lee Hock Eng has worked with various companies, including Dicon (S) Pte Ltd and Dicon Connectors, Inc. His experience in these organizations has contributed to his expertise in developing innovative solutions in the electronics industry.
Collaborations
Lee has collaborated with notable individuals such as Steven Paul Gasparovic and Ng Lea Swee, further enhancing his work and contributions to the field.
Conclusion
Lee Hock Eng's innovative patents and career achievements highlight his significant role in advancing technology in cable-to-board arrangements. His work continues to influence the electronics industry positively.