The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Aug. 12, 1997
Peter J Brofman, Hopewell Junction, NY (US);
Patrick A Coico, Fishkill, NY (US);
Mark G Courtney, Poughkeepsie, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
Lewis S Goldmann, Bedford, NY (US);
Raymond A Jackson, Poughkeepsie, NY (US);
David C Linnell, Poughkeepsie, NY (US);
Gregory B Martin, Wappingers Falls, NY (US);
Frank L Pompeo, Montgomery, NY (US);
Kathleen A Stalter, Hopewell Junction, NY (US);
Hilton T Toy, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.