The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1999
Filed:
Aug. 12, 1997
Peter J Brofman, Hopewell Junction, NY (US);
Patrick A Coico, Fishkill, NY (US);
Mark G Courtney, Poughkeepsie, NY (US);
James H Covell, II, Poughkeepsie, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
Lewis S Goldmann, Bedford, NY (US);
Raymond A Jackson, Poughkeepsie, NY (US);
David C Linnell, Poughkeepsie, NY (US);
Gregory B Martin, Wappingers Falls, NY (US);
Frank L Pompeo, Montgomery, NY (US);
Kathleen A Stalter, Hopewell Junction, NY (US);
Hilton T Toy, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.