The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 1997
Filed:
Jun. 07, 1995
Lawrence R Cutting, Owego, NY (US);
Michael A Gaynes, Vestal, NY (US);
Eric A Johnson, Greene, NY (US);
Cynthia S Milkovich, Vestal, NY (US);
Jeffrey S Perkins, Endwell, NY (US);
Mark V Pierson, Binghamton, NY (US);
Steven E Poetzinger, Endicott, NY (US);
Jerzy Zalesinski, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.