Cynthia Susan Milkovich

This inventor holds 15 USPTO granted patents, primarily in Electronic Packaging. Top assignee: International Business Machines Corporation. Active years: 1997-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cynthia Susan Milkovich. Retrieved from https://idiyas.com/inventor/cynthia-susan-milkovich

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 80.0

Average Co-Inventor Count = 4.2

ph-index = 12

Forward Citations = 372(Granted Patents)

Company Filing History:

15 out of 166,425

International Business Machines Corporation

patents

Years Active: 1997-2007

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Areas of Expertise:

Electronic Package

Flip Chip

C4 Extension

CTE Compensation

Compliant Layer

Encapsulation

Solder Bumps

Flexible Circuit Board

Heat Spreader

Chip Interposer

Assembly Process

Manufacturing

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7278207 - Method of making an electronic package (2007-10-09),

2. 6961995 - Method of making an electronic package (2005-11-08),

3. 6955982 - Flip chip C4 extension structure and process (2005-10-18),

4. 6756680 - Flip chip C4 extension structure and process (2004-06-29),

5. 6664637 - Flip chip C4 extension structure and process (2003-12-16),

6. 6516513 - Method of making a CTE compensated chip interposer (2003-02-11),

7. 6486415 - Compliant layer for encapsulated columns (2002-11-26),

8. 6399892 - CTE compensated chip interposer (2002-06-04),

9. 6225206 - Flip chip C4 extension structure and process (2001-05-01),

10. 6100114 - Encapsulation of solder bumps and solder connections (2000-08-08),

11. 5969945 - Electronic package assembly (1999-10-19),

12. 5831828 - Flexible circuit board and common heat spreader assembly (1998-11-03),

13. 5759269 - Manufacturing flexible circuit board assemblies and printer for (1998-06-02),

14. 5729896 - Method for attaching a flip chip on flexible circuit carrier using chip (1998-03-24),

15. 5638597 - Manufacturing flexible circuit board assemblies with common heat (1997-06-17),

Title: **Innovative Contributions of Cynthia Susan Milkovich**

Introduction

Cynthia Susan Milkovich is a prominent inventor based in Vestal, New York, recognized for her significant contributions to the field of electronic packaging. With a remarkable portfolio of 15 patents, she has made substantial advancements, particularly in methodologies that enhance electronic component performance.

Latest Patents

Cynthia's latest innovation involves a method of making an electronic package that optimizes the integration of semiconductor chips. This innovative electronic package features a dielectric material layer over a substrate with conductive contacts. Notably, it employs through holes that align with these contacts, allowing for conductive material to enhance connectivity and improve the operating life of assemblies. These advancements are essential for the electronics industry, focusing on robust performance and reliability.

Career Highlights

Cynthia Milkovich is associated with the International Business Machines Corporation (IBM), where she applies her expertise in electronics and materials science. Throughout her career, she has demonstrated a commitment to pushing the boundaries of technology in electronic packaging, and her inventions reflect her deep understanding of engineering principles.

Collaborations

Notably, Cynthia has collaborated with skilled coworkers Mark Vincent Pierson and Miguel Angel Jimarez. Together, they contribute to the collaborative innovation culture at IBM, fostering an environment where novel ideas can thrive and be translated into practical solutions for the electronics sector.

Conclusion

Cynthia Susan Milkovich stands out as an influential inventor whose work has profound implications for the future of electronic packaging. Her dedication to innovation not only enhances product performance but also sets a benchmark for engineering excellence in the industry. Through her patents and collaborations, she continues to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]