Jeffrey S Perkins

Title: Innovations of Jeffrey S. Perkins

Introduction

Jeffrey S. Perkins is a notable inventor based in Endwell, NY (US), recognized for his contributions to electronic circuit packaging. With a total of six patents to his name, Perkins has made significant advancements in the field of electronics.

Latest Patents

Among his latest patents, Perkins has developed a method for the use of blind vias for soldered interconnections between substrates and printed wiring boards. This innovative method involves connecting two conductive layers in an electronic circuit package by placing blind vias in both the first and second substrates, allowing for efficient electrical connections. Additionally, he has patented an electronic package assembly that utilizes a screen printing fixture to hold a flexible circuit board, enabling the attachment of components through a solder paste pattern.

Career Highlights

Perkins is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of electronic design and assembly. His work has been instrumental in enhancing the functionality and reliability of electronic devices.

Collaborations

Throughout his career, Perkins has collaborated with esteemed colleagues, including Lawrence Richard Cutting and Michael A. Gaynes, contributing to various innovative projects and patents.

Conclusion

Jeffrey S. Perkins stands out as a prominent inventor in the electronics industry, with a strong portfolio of patents that reflect his expertise and innovative spirit. His contributions continue to shape the future of electronic circuit design and assembly.