Lawrence Richard Cutting

Title: The Innovations of Lawrence Richard Cutting

Introduction

Lawrence Richard Cutting is a notable inventor based in Owego, NY (US). He has made significant contributions to the field of technology, particularly in the area of wire bonding techniques. With a total of 8 patents to his name, Cutting's work has had a lasting impact on the industry.

Latest Patents

One of his latest patents focuses on wire bonding to dual metal covered pad surfaces. This innovative technique allows wire bonds to be made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200°C. The process involves a layer of palladium thicker than 14 micro-inches, which is covered with a thin flash of gold. To protect palladium coated over copper pads from copper diffusion, a thin nickel layer is positioned between the two. Subsequent baking for 1 hour at 185°C drives off hydrogen molecules, provided the gold is less than 200 angstroms thick. A bonding wire, preferably of gold, is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200°C.

Career Highlights

Lawrence Cutting has had a distinguished career at International Business Machines Corporation (IBM). His work has been instrumental in advancing the technology used in electronic components. His innovative approaches have not only improved existing methods but have also paved the way for new applications in the field.

Collaborations

Throughout his career, Cutting has collaborated with several talented individuals, including Michael A Gaynes and Mark Vincent Pierson. These collaborations have contributed to the success of his projects and the development of new technologies.

Conclusion

Lawrence Richard Cutting's contributions to the field of technology through his patents and innovative techniques have made a significant impact. His work continues to influence the industry, showcasing the importance of creativity and collaboration in advancing technology.