The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 1995
Filed:
Aug. 03, 1993
Umar M Ahmad, Both of Hopewell Junction, NY (US);
Ananda H Kumar, Both of Hopewell Junction, NY (US);
Eric D Perfecto, Wappingers Falls, NY (US);
Chandrika Prasad, Wappingers Falls, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
Sudipta K Ray, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.