The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1995
Filed:
Nov. 02, 1993
Hiroko Nakamura, Yokohama, JP;
Haruki Komano, Yokohama, JP;
Kazuyoshi Sugihara, Yokosuka, JP;
Keiji Horioka, Yokohama, JP;
Mitsuyo Kariya, Tokyo, JP;
Soichi Inoue, Yokohama, JP;
Ichiro Mori, Yokohama, JP;
Katsuya Okumura, Poughkeepsie, NY (US);
Tadahiro Takigawa, Kawasaki, JP;
Toru Watanabe, Hopewell Junction, NY (US);
Motosuke Miyoshi, Tokyo, JP;
Yuichiro Yamazaki, Tokyo, JP;
Haruo Okano, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal.