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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12783774 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Nov. 29, 2021

Bonded semiconductor device and method for forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Shih-Han Huang, Kaohsiung City, TW;

Wen-I Hsu, Tainan City, TW;

Shuang-Ji Tsai, Tainan City, TW;

Ming-Hsien Yang, Taichung City, TW;

Yen-Ting Chiang, Tainan City, TW;

Shyh-Fann Ting, Tainan City, TW;

Feng-Chi Hung, Hsin-Chu County, TW;

Jen-Cheng Liu, Hsin-Chu City, TW;

Dun-Nian Yaung, Taipei City, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

HAYNES AND BOONE, LLP

Primary Examiner:

Marc-Anthony Armand

Int. Cl.
CPC ...
G06F 30/392 (2020.01); H10F 39/00 (2025.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); H10W 72/0198 (2026.01); H10F 39/809 (2025.01); H10W 72/926 (2026.01); H10W 72/9445 (2026.01); H10W 80/163 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01);
Abstract

A method for wafer bonding includes receiving a layout of a bonding layer with an asymmetric pattern, determining whether an asymmetry level of the layout is within a predetermined range by a design rule checker, modifying the layout to reduce the asymmetry level of the layout if the asymmetry level is beyond the predetermined range. The method also includes outputting the layout in a computer-readable format.

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Huang, Shih-Han. (2026). Bonded semiconductor device and method for forming the same (U.S. Patent No. 12783774). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12783774

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