Laminate substrate-based differential pressure sensor package combining air cavity channel substrate, overmold, and lid with two chimneys

Abstract

The sensor device includes a substrate having upper and lower surfaces with a channel formed therebetween. First and second port holes are formed through the upper surface to the channel. The sensor device also includes an application-specific integrated circuit (ASIC) die mounted on the upper surface so as not to cover the first and second port holes. The sensor device further includes an overmolding formed on the upper surface that is molded over the ASIC die and forms first and second cavities surrounding the first and second port holes, respectively. The sensor device also includes a transducer electrically connected with the ASIC die and mounted within the first cavity on the upper surface so as to cover the first port hole. The sensor device further includes a lid attached to the overmolding having first and second chimneys.