This inventor holds 1 USPTO granted patent. Top assignees: Mems Vision International Inc., Renesas Electronics America Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2026
Title: Hani H. Tawfik: Inventor of a Differential Pressure Sensor Package.
Introduction
Hani H. Tawfik is an inventor associated with Montreal, Canada. His patent work includes a differential pressure sensor package that integrates a channel-bearing substrate, an ASIC, an overmold, a transducer, and a lid.
Latest Patents
Tawfik is credited with 1 patent: “Laminate substrate-based differential pressure sensor package combining air cavity channel substrate, overmold, and lid with two chimneys.” The device has a substrate with a channel between its upper and lower surfaces and two port holes connecting the upper surface to the channel. An ASIC die is mounted on the upper surface without covering the port holes. An overmold covers the ASIC and forms separate cavities around the two ports. A transducer, electrically connected to the ASIC, sits in the first cavity and covers the first port hole. The lid attaches to the overmold and includes two chimneys.
Career Highlights
The available information associates Tawfik with Renesas Electronics America Inc. and MEMS Vision International Inc. His patent describes a package architecture that combines pressure-sensing components and distinct air pathways.
Collaborations
Tawfik’s listed coworkers include Gaurav Mehrotra and Km Rafidh Hassan. The available details identify these professional associations but do not specify particular joint projects.
Conclusion
Hani H. Tawfik’s recorded invention focuses on packaging a differential pressure sensor with an ASIC, transducer, molded cavities, and a two-chimney lid.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile