MONTREAL, Canada

Hani H Tawfik

This inventor holds 1 USPTO granted patent. Top assignees: Mems Vision International Inc., Renesas Electronics America Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hani H Tawfik. Retrieved from https://idiyas.com/inventor/hani-h-tawfik

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hani H. Tawfik: Inventor of a Differential Pressure Sensor Package.

Introduction

Hani H. Tawfik is an inventor associated with Montreal, Canada. His patent work includes a differential pressure sensor package that integrates a channel-bearing substrate, an ASIC, an overmold, a transducer, and a lid.

Latest Patents

Tawfik is credited with 1 patent: “Laminate substrate-based differential pressure sensor package combining air cavity channel substrate, overmold, and lid with two chimneys.” The device has a substrate with a channel between its upper and lower surfaces and two port holes connecting the upper surface to the channel. An ASIC die is mounted on the upper surface without covering the port holes. An overmold covers the ASIC and forms separate cavities around the two ports. A transducer, electrically connected to the ASIC, sits in the first cavity and covers the first port hole. The lid attaches to the overmold and includes two chimneys.

Career Highlights

The available information associates Tawfik with Renesas Electronics America Inc. and MEMS Vision International Inc. His patent describes a package architecture that combines pressure-sensing components and distinct air pathways.

Collaborations

Tawfik’s listed coworkers include Gaurav Mehrotra and Km Rafidh Hassan. The available details identify these professional associations but do not specify particular joint projects.

Conclusion

Hani H. Tawfik’s recorded invention focuses on packaging a differential pressure sensor with an ASIC, transducer, molded cavities, and a two-chimney lid.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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