Karim Allidina

Title: Karim Allidina and His Differential Pressure Sensor Package

Introduction

Karim Allidina is an inventor associated with Montreal, Canada. His patent work includes a differential pressure sensor package that integrates a channel-bearing substrate, an ASIC die, an overmold, a transducer, and a lid.

Latest Patents

Allidina is credited with 1 patent: “Laminate Substrate-Based Differential Pressure Sensor Package Combining Air Cavity Channel Substrate, Overmold, and Lid with Two Chimneys.”

The invention describes a substrate with a channel between its upper and lower surfaces and two port holes connecting the upper surface to the channel. An ASIC die is mounted on the upper surface without covering the port holes. An overmold covers the ASIC die and forms separate cavities around the two ports. A transducer is mounted in the first cavity and covers the first port hole, while a lid attached to the overmold includes two chimneys. Together, these components form a packaged sensor designed to measure differential pressure.

Career Highlights

Allidina’s listed company affiliations include Renesas Electronics America Inc. and MEMS Vision International Inc. His patent reflects work on sensor packaging and the integration of pressure-sensing components.

Collaborations

Listed coworkers include Gaurav Mehrotra and Km Rafidh Hassan. Their names are associated with Allidina’s professional network.

Conclusion

Karim Allidina’s patent documents a compact differential pressure sensor package that combines a channel substrate, electronic circuitry, a transducer, and a two-chimney lid.