Steven Lee

Title: Steven Lee and His Differential Pressure Sensor Package Patent.

Introduction

Steven Lee is an inventor associated with Walnut, California. His patent work includes a differential pressure sensor package that combines a laminate substrate, an overmold, and a lid with two chimneys.

Latest Patents

Lee is credited with 1 patent, titled “Laminate Substrate-Based Differential Pressure Sensor Package Combining Air Cavity Channel Substrate, Overmold, and Lid with Two Chimneys.”

The sensor package has a substrate with upper and lower surfaces and a channel between them. Two port holes connect the upper surface to the channel. An application-specific integrated circuit (ASIC) die is mounted on the upper surface without covering either port hole. An overmold covers the ASIC die and forms separate cavities around the two port holes. A transducer, electrically connected to the ASIC die, sits in the first cavity and covers the first port hole. A lid attached to the overmold has two chimneys.

Career Highlights

Lee’s listed company affiliations include Renesas Electronics America Inc. and MEMS Vision International Inc. The available information does not specify his roles or dates of employment at these companies.

Collaborations

Gaurav Mehrotra and Km Rafidh Hassan are identified as Lee’s coworkers. The available information does not describe specific joint projects or patent contributions.

Conclusion

Steven Lee’s patent describes a compact differential pressure sensor package that integrates a channel-bearing substrate, ASIC die, transducer, overmolded cavities, and a two-chimney lid.