Tommy Kwong Kin Tsang

Title: Tommy Kwong Kin Tsang: Sensor Packaging Inventor.

Introduction

Tommy Kwong Kin Tsang is an inventor based in Montreal, Canada. His work includes a patented sensor package design that combines a laminate substrate, an overmold, and a lid.

Latest Patents

Tsang is associated with 1 patent. The patent, “Laminate Substrate-Based Differential Pressure Sensor Package Combining Air Cavity Channel Substrate, Overmold, and Lid with Two Chimneys,” describes a sensor device built around a substrate with a channel between its upper and lower surfaces. Two port holes connect the upper surface to the channel, while an application-specific integrated circuit (ASIC) die is mounted nearby without covering either port.

An overmold covers the ASIC die and forms separate cavities around the two port holes. A transducer is electrically connected to the ASIC die and positioned in the first cavity over the first port hole. A lid attached to the overmold includes two chimneys.

Career Highlights

Tsang has been associated with Renesas Electronics America Inc. and Mems Vision International Inc. His patent reflects work on packaging for differential pressure sensors, integrating the substrate, circuitry, transducer, cavities, and lid into a single device structure.

Collaborations

Gaurav Mehrotra and Km Rafidh Hassan are identified as Tsang’s coworkers.

Conclusion

Tommy Kwong Kin Tsang’s patented sensor package brings together a channel-based substrate, an ASIC, a transducer, an overmold, and a two-chimney lid in a design for differential pressure sensing.