The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Jan. 14, 2025
Global Unichip Corporation, Hsinchu City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
GLOBAL UNICHIP CORPORATION, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A heterogeneous thermal interface material element includes a graphite liner and a soft thermal conductive sheet. The graphite liner has an upper layer, a lower layer opposite to the upper layer, an arc-shaped portion integrally connected to the upper layer and the lower layer so as to mutually form a C-shaped bag structure, and a sealing portion. The soft thermal conductive sheet is completely received in the C-shaped bag structure and sandwiched between the upper layer and the lower layer. The C-shaped bag structure is formed with a bag mouth sealed by the sealing portion. The soft thermal conductive sheet and the graphite liner are different materials. The thermal conductivity coefficient of the graphite liner is greater than that of the soft thermal conductive sheet, and the ductility of the soft thermal conductive sheet is greater than that of the graphite liner.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile