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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12759108 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Jan. 17, 2022

Polishing method, and polishing apparatus

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masashi Kabasawa, Tokyo, JP;

Toshimitsu Sasaki, Tokyo, JP;

Yoichi Shiokawa, Tokyo, JP;

Keita Yagi, Tokyo, JP;

Yuki Watanabe, Tokyo, JP;

Nachiketa Chauhan, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

Chrisman Gallo Tochtrop LLC

Primary Examiner:

Joel D Crandall

Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/013 (2012.01); B24B 49/04 (2006.01); B24B 49/14 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/013 (2013.01); B24B 49/04 (2013.01); B24B 49/14 (2013.01);
Abstract

The present application relates to a polishing method and a polishing apparatus for polishing a substrate, such as a wafer, while pressing the substrate against a polishing surface of a polishing pad, and more particularly to a polishing method and a polishing apparatus for polishing a substrate while regulating a polishing load based on measurement values of a film-thickness measuring device. The polishing method includes: controlling a temperature of a polishing surface of a polishing pad to a predetermined temperature by use of a pad-temperature regulating apparatus; and polishing a substrate while controlling a polishing load for pressing the substrate against the polishing surface based on measurement values from a film-thickness measuring device provided in the polishing pad.

Find Patent Forward Citations

Kabasawa, Masashi. (2026). Polishing method, and polishing apparatus (U.S. Patent No. 12759108). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12759108

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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