The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jan. 31, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Rawan Naous, Hsinchu, TW;
Kerem Akarvardar, Hsinchu, TW;
Hidehiro Fujiwara, Hsinchu, TW;
Haruki Mori, Hsinchu, TW;
Yu-Der Chih, Hsinchu, TW;
Mahmut Sinangil, Hsinchu, TW;
Yih Wang, Hsinchu, TW;
Jonathan Tsung-Yung Chang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit includes a first encoder, a compute in-memory (CIM) array and a de-encoder. The first encoder is configured to quantize a first received signal into a first signal. The first received signal has a first floating point number format. The first signal has an integer number format. The compute in-memory (CIM) array is coupled to the first encoder. The CIM array is configured to generate a CIM signal in response to at least the first signal. The CIM signal has the integer number format. The de-encoder is coupled to the CIM array, and is configured to generate a first output signal in response to the CIM signal. The first output signal has a second floating point number format.