The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jul. 13, 2023
Taiwan Semiconductor Manufacturing Company, Ltd, Hsinchu, TW;
Tzu Pei Chen, Taipei City, TW;
Sung-Li Wang, Hsinchu County, TW;
Shin-Yi Yang, New Taipei City, TW;
PO-Chin Chang, Taichung City, TW;
Yuting Cheng, Taoyuan City, TW;
Chia-Hung Chu, Taipei City, TW;
Chun-Hung Liao, Taichung, TW;
Harry Chien, Chandler, AZ (US);
Chia-Hao Chang, Hsinchu City, TW;
Pinyen Lin, Rochester, NY (US);
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An integrated circuit (IC) with conductive structures and a method of fabricating the IC are disclosed. The method includes depositing a first dielectric layer on a semiconductor device, forming a conductive structure in the first dielectric layer, removing a portion of the first dielectric layer to expose a sidewall of the conductive structure, forming a barrier structure surrounding the sidewall of the conductive structure, depositing a conductive layer on the barrier structure, and performing a polishing process on the barrier structure and the conductive layer.