The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jul. 31, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Du Zhang, Albany, NY (US);
Koki Mukaiyama, Miyagi, JP;
Takatoshi Orui, Hillsboro, OR (US);
Tomohiko Niizeki, Miyagi, JP;
Maju Tomura, Miyagi, JP;
Yoshihide Kihara, Miyagi, JP;
Mingmei Wang, Albany, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01); H10P 14/20 (2026.01); H10P 14/692 (2026.01); H10P 50/00 (2026.01); H10P 50/24 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6336 (2026.01); H10P 14/3406 (2026.01); H10P 14/3454 (2026.01); H10P 14/6339 (2026.01); H10P 14/668 (2026.01); H10P 14/6939 (2026.01); H10P 50/242 (2026.01); H10P 50/692 (2026.01);
Abstract
A method for processing a substrate that includes: forming a passivation layer over sidewalls of a recess in a carbon-containing layer over a substrate by a cyclic passivation process including a plurality of cycles, each of the plurality of cycles including, exposing the substrate to a first gas including a refractory metal in the absence of a plasma, and after exposing to the first gas, exposing the substrate to a second gas including oxygen or nitrogen.