The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Feb. 22, 2023
Carl Zeiss Smt Gmbh, Oberkochen, DE;
Thomas Korb, Schwaebisch Gmuend, DE;
Eugen Foca, Ellwangen, DE;
Philipp Huethwohl, Ulm, DE;
Dmitry Klochkov, Schwaebisch Gmuend, DE;
Jens Timo Neumann, Aalen, DE;
Ramani Pichumani, Palo Alto, CA (US);
Keumsil Lee, Palo Alto, CA (US);
Carl Zeiss SMT GmbH, Oberkochen, DE;
Abstract
A method of 3D-inspection of a semiconductor object inside of an inspection volume of a wafer or wafer sample comprises a 3D data processing and a step for acquiring a plurality of two-dimensional images. The acquiring step comprises a monitoring step for determining whether a two-dimensional image is in conformity with a desired property of the 3D data processing. The disclosure further comprises a method of configuring the method of 3D-inspection and a system configured to execute the method of 3D-inspection as well as the method of configuring the method of 3D-inspection.