The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Sep. 28, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Lichen Weng, San Jose, CA (US);

Ramadass Nagarajan, Portland, OR (US);

Anand Jayaraman, Sunnyvale, CA (US);

Vijeta Prasad, Fremont, CA (US);

Justin Reyes, San Jose, CA (US);

Gurucharapathy Karthikeyan, Karnataka, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 45/745 (2022.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); H04L 45/16 (2022.01); H04L 49/109 (2022.01);
U.S. Cl.
CPC ...
H04L 45/745 (2013.01); G06F 13/4027 (2013.01); G06F 13/42 (2013.01); H04L 45/16 (2013.01); H04L 49/109 (2013.01);
Abstract

In one embodiment, a first chiplet includes: a plurality of agents to generate messages, each of the messages having a destination port identifier comprising a first portion to identify a destination chiplet and a second portion to identify a destination agent on the destination chiplet; a die-to die bridge to couple the first chiplet to a second chiplet; a fabric coupled to the die-to-die bridge to route communications between the plurality of agents, where a first agent is to generate a first message having a first destination port identifier; and a first fabric adapter coupled to the first agent, the first fabric adapter to direct the first message to the die-to-die bridge when the first portion of the first destination port identifier identifies a second chiplet as the destination chiplet. Other embodiments are described and claimed.


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