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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12609269 B1

PDFFull Text
Date of Patent:
Apr. 21, 2026

Filed:

Sep. 18, 2020

Inspection system

Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Natsuki Tsuno, Tokyo, JP;

Yasuhiro Shirasaki, Tokyo, JP;

Minami Shouji, Tokyo, JP;

Daisuke Bizen, Tokyo, JP;

Makoto Suzuki, Tokyo, JP;

Satoshi Takada, Tokyo, JP;

Yohei Nakamura, Tokyo, JP;

Assignee:

Hitachi High-Tech Corporation, Tokyo, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Wyatt A Stoffa

Int. Cl.
CPC ...
H01J 37/22 (2006.01); H01J 37/244 (2006.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); H01J 37/226 (2013.01); H01J 37/244 (2013.01); H01J 2237/2448 (2013.01);
Abstract

This inspection systemcomprises: an electron sourcewhich irradiates a samplewith an inspection beam; a detectorwhich detects secondary electrons obtained by irradiating the samplewith the inspection beam and outputs a detection signal; a laser devicewhich emits an action laser that changes the amount of secondary electrons; an electron gunwhich emits an action electron beam that changes the amount of secondary electrons; and a computer systemwhich generates an image of the sampleon the basis of the detection signal. The computer systemgenerates an inspection image Irelated to the emission of the inspection beam, acquires the dimensions and the like related to a pattern on the sampleon the basis of the inspection image I, generates an inspection image Irelated to the emission of the action laser and the inspection beam, acquires the material characteristics related to the pattern on the basis of the inspection image I, generates an inspection image Irelated to the emission of the action electron beam and the inspection beam, and acquires the electrical characteristics related to the pattern on the basis of the inspection image I

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