The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Jun. 01, 2021
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Kyoung-Keun Lee, Cary, NC (US);
Fabian Radulescu, Chapel Hill, NC (US);
Scott Sheppard, Chapel Hill, NC (US);
Daniel Namishia, Wake Forest, NC (US);
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H10W 42/00 (2026.01); H10W 74/01 (2026.01); H10W 74/43 (2026.01);
U.S. Cl.
CPC ...
H10W 42/00 (2026.01); H10W 74/01 (2026.01); H10W 74/43 (2026.01);
Abstract
A semiconductor die includes a semiconductor body, and a multi-layer environmental barrier on the semiconductor body. The multi-layer environmental barrier includes first and second sublayers of first and second oxide materials, respectively, where the first oxide material is different than the second oxide material. Related devices and fabrication methods are also discussed.
Lee, Kyoung-Keun. (2026). Multilayer encapsulation for humidity robustness and related fabrication methods (U.S. Patent No. 12598994). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598994
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile