The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Dec. 02, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Ge Qu, Sunnyvale, CA (US);
Qihao Zhu, Sunnyvale, CA (US);
Zheng Ju, Sunnyvale, CA (US);
Yang Zhou, Milpitas, CA (US);
Jiajie Cen, San Jose, CA (US);
Feng Q. Liu, San Jose, CA (US);
Zhiyuan Wu, San Jose, CA (US);
Feng Chen, San Jose, CA (US);
Kevin Kashefi, San Ramon, CA (US);
Xianmin Tang, San Jose, CA (US);
Jeffrey W. Anthis, Santa Clara, CA (US);
Mark Joseph Saly, Milpitas, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76849 (2013.01); H01L 21/32051 (2013.01); H01L 21/76877 (2013.01);
Abstract
Methods to deposit a metal cap for an interconnect are disclosed. In embodiments, a method comprises contacting the substrate with an alkyl halide and a ruthenium metal precursor to form a metal cap for an interconnect.