The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Dec. 13, 2022
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Tu Hong, Tualatin, OR (US);

Chunhai Ji, Portland, OR (US);

Pengyi Zhang, Beaverton, OR (US);

Niraj Rana, West Linn, OR (US);

Feng Bi, Lake Oswego, OR (US);

Ming Li, West Linn, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/509 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4404 (2013.01); C23C 16/0227 (2013.01); C23C 16/308 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/4405 (2013.01); C23C 16/5096 (2013.01); C23C 16/52 (2013.01); H01J 37/32449 (2013.01); H01L 21/6833 (2013.01); H01J 2237/3321 (2013.01);
Abstract

An electrostatic chuck (ESC) undercoating system includes a memory and a controller. The memory stores an undercoat application. The controller configured to execute the undercoat application to: determine undercoat parameters; perform a full clean process to remove undercoat deposits in processing chamber of substrate processing system; and based on the undercoat parameters, perform one or more deposition processes to deposit one or more undercoat layers on the ESC to provide an overall undercoat layer having an overall thickness between 7-15 μm, the one or more undercoat layers providing protection of the ESC during subsequent deposition processing of a substrate on the ESC.


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