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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12564879 B1

PDFFull Text
Date of Patent:
Mar. 03, 2026

Filed:

Sep. 30, 2019

Copper paste for joining, method for manufacturing joined body, and joined body

Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Motohiro Negishi, Tokyo, JP;

Hideo Nakako, Tokyo, JP;

Michiko Natori, Tokyo, JP;

Dai Ishikawa, Tokyo, JP;

Chie Sugama, Tokyo, JP;

Yuki Kawana, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

FITCH, EVEN, TABIN & FLANNERY, LLP

Primary Examiner:

Sally A Merkling

Assistant Examiner:

Nazmun Nahar Shams

Int. Cl.
CPC ...
B22F 1/052 (2022.01); B22F 1/00 (2022.01); B22F 1/054 (2022.01); B22F 1/0545 (2022.01); B22F 1/062 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/145 (2022.01); B22F 7/00 (2006.01); B22F 7/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/052 (2022.01); B22F 1/00 (2013.01); B22F 1/0545 (2022.01); B22F 1/056 (2022.01); B22F 1/09 (2022.01); B22F 1/107 (2022.01); B22F 1/147 (2022.01); B22F 7/008 (2013.01); B22F 7/08 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B22F 1/062 (2022.01); B22F 1/068 (2022.01); B22F 2301/10 (2013.01); B22F 2302/45 (2013.01); B22F 2303/40 (2013.01); B22F 2304/056 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

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