The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Dec. 08, 2021
International Business Machines Corporation, Armonk, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Balasubramanian S. Pranatharthiharan, Santa Clara, CA (US);
Stuart Sieg, Albany, NY (US);
Nelson Felix, Slingerlands, NY (US);
Veeraraghavan S. Basker, Schenectady, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Embodiments of the invention are directed to a method of fabricating an integrated circuit (IC). The method includes performing fabrication operations to form transistors on a substrate. The fabrication operations include forming a sacrificial metal gate and forming a shared non-sacrificial metal gate. The sacrificial metal gate is recessed to form a sacrificial metal gate, and the shared non-sacrificial metal gate is recessed to form a recessed shared non-sacrificial metal gate. A pattern is formed over the sacrificial metal gate and the recessed shared non-sacrificial metal gate. The pattern defines a single diffusion break footprint over a top surface of the sacrificial metal gate, along with a gate-cut footprint over a central region of a top surface of the recessed shared non-sacrificial metal gate.