The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Jan. 26, 2022
Applied Materials, Inc., Santa Clara, CA (US);
Ramesh Gopalan, Fremont, CA (US);
Robert Toshiharu Hirahara, San Jose, CA (US);
Stanley Wu, Santa Clara, CA (US);
Michael Prestoza Decena, Hayward, CA (US);
Wendell Boyd, Santa Clara, CA (US);
Siamak Salimian, Los Altos, CA (US);
Thomas Brezoczky, Los Gatos, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sparameter is less than approximately 0.1 microns, an Sparameter is less than approximately 2.5 percent, an Sparameter is less than approximately 10 microns for any given area of approximately 10 mmof the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile