This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Wendell Boyd in Electrostatic Chuck Technology
Introduction
Wendell Boyd is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of electrostatic chuck technology. His innovative work focuses on methods and apparatus that enhance the performance of electrostatic chucks.
Latest Patents
Wendell Boyd holds 1 patent for his invention titled "Methods for electrostatic chuck ceramic surfacing." This patent addresses the reduction of chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces. The method involves placing the electrostatic chuck assembly in a planarizing apparatus and altering its upper ceramic surface until specific S-parameter thresholds are met.
Career Highlights
Wendell Boyd is associated with Applied Materials, Inc., a leading company in the semiconductor industry. His work at Applied Materials has been instrumental in advancing technologies that improve manufacturing processes for electronic devices.
Collaborations
Wendell has collaborated with talented coworkers, including Michael Prestoza Decena and Stanley Wu. Their combined expertise contributes to the innovative environment at Applied Materials.
Conclusion
Wendell Boyd's contributions to electrostatic chuck technology exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to enhancing manufacturing efficiency and precision.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile