The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Mar. 03, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Leonard P. Guler, Hillsboro, OR (US);

Madeleine Beasley, Beaverton, OR (US);

Allen B. Gardiner, Portland, OR (US);

Aryan Navabi Shirazi, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Sairam Subramanian, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/00 (2025.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 21/28123 (2013.01); H01L 21/0259 (2013.01); H10D 30/031 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/118 (2025.01); H10D 84/0128 (2025.01); H10D 84/0151 (2025.01); H10D 84/0153 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01);
Abstract

Techniques are provided herein to form semiconductor devices having self-aligned gate cut structures. In an example, neighboring semiconductor devices each include a semiconductor region extending between a source region and a drain region, and a gate structure extending over the semiconductor regions of the neighboring semiconductor devices. A gate cut structure that includes a dielectric material interrupts the gate structure between the neighboring semiconductor devices. Due to the process of forming the gate cut structure, the distance between the gate cut structure and the semiconductor region of one of the neighboring semiconductor devices is substantially the same as (e.g., within 1.5 nm of) the distance between the gate cut structure and the semiconductor region of the other one of the neighboring semiconductor devices and the gate cut structure extends beyond the width of the gate structure to also interrupt gate spacers on the sidewalls of the gate structure.


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