The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Aug. 19, 2022
Intel Corporation, Santa Clara, CA (US);
Omkar G. Karhade, Chandler, AZ (US);
Tomita Yoshihiro, Tsukuba, JP;
Adel A. Elsherbini, Chandler, AZ (US);
Bhaskar Jyoti Krishnatreya, Hillsboro, OR (US);
Tushar Talukdar, Wilsonville, OR (US);
Haris Khan Niazi, Scottsdale, AZ (US);
Yi Shi, Chandler, AZ (US);
Batao Zhang, Gilbert, AZ (US);
Wenhao Li, Chandler, AZ (US);
Feras Eid, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die having a surface; a template structure having a first surface and an opposing second surface, wherein the first surface of the template structure is coupled to the surface of the first die, and wherein the template structure includes a cavity at the first surface and a through-template opening extending from a top surface of the cavity to the second surface of the template structure; and a second die within the cavity of the template structure and electrically coupled to the surface of the first die by interconnects having a pitch of less than 10 microns between adjacent interconnects.