The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Feb. 18, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chia-Yuan Chang, Hsinchu, TW;

Xiong-Fei Yu, Hsinchu, TW;

Hui-Cheng Chang, Tainan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); B82Y 10/00 (2011.01); H01L 21/02 (2006.01); H01L 21/3115 (2006.01); H01L 21/8238 (2006.01); H01L 21/8258 (2006.01); H01L 29/06 (2006.01); H01L 29/161 (2006.01); H01L 29/20 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 30/69 (2025.01); H10D 62/10 (2025.01); H10D 62/832 (2025.01); H10D 62/85 (2025.01); H10D 64/01 (2025.01); H10D 64/66 (2025.01); H10D 64/68 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/08 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H10D 84/853 (2025.01); B82Y 10/00 (2013.01); H01L 21/02532 (2013.01); H01L 21/02538 (2013.01); H01L 21/3115 (2013.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 62/123 (2025.01); H10D 62/832 (2025.01); H10D 64/017 (2025.01); H10D 64/667 (2025.01); H10D 64/681 (2025.01); H10D 64/691 (2025.01); H10D 84/0167 (2025.01); H10D 84/038 (2025.01); H10D 84/08 (2025.01); H10D 30/797 (2025.01); H10D 62/85 (2025.01); H10D 84/0172 (2025.01); H10D 84/0193 (2025.01);
Abstract

A semiconductor device includes first and second fins, first and second hafnium oxide layers, first and second cap layers, and first and second metal gate electrodes. The first and second fins protrude above a substrate and respectively have an n-channel region and a p-channel region. The first and second hafnium oxide layers wrap around the n-channel region and the p-channel region, respectively. The first and second cap layers wrap around the first and second annular hafnium oxide layers, respectively. The first and second cap layers are made of a same material that is lanthanum oxide, yttrium oxide, or strontium oxide. The first and second metal gate electrodes wrap around the first and second cap layers, respectively. The first and second metal gate electrodes have a same metal composition. The first and second gate dielectrics have a same dielectric composition.


Find Patent Forward Citations

Loading…