The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Mar. 18, 2024
Applicant:

Brewer Science, Inc., Rolla, MO (US);

Inventors:

Andrea M. Chacko, Rolla, MO (US);

Vandana Krishnamurthy, Rolla, MO (US);

Yichen Liang, Round Rock, TX (US);

Hao Lee, Camas, WA (US);

Stephen Grannemann, Rolla, MO (US);

Douglas J. Guerrero, Tombeek, BE;

Assignee:

Brewer Science, Inc., Rolla, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 1/24 (2012.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); G03F 1/24 (2013.01); G03F 7/70033 (2013.01); H01L 21/02115 (2013.01); H01L 21/02282 (2013.01); H01L 21/02304 (2013.01); H01L 21/02422 (2013.01);
Abstract

New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.


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